This system is suitable for laser marking of various metal or non-metal products of tridimensional curved surface, widely used in laser 3D marking of products in mobile phone manufacturing, stereo circuit, medical device, mold, 3C electronic, auto parts and electronic communication.
| Features | Technical parameters | |
| Mobile Mid Bezel and Frame Laser Marking System | Easy to operate, four sides of mid bezel or frame can be automatic marked at one time;
360 degree freely rotation, focus length adjust automaticly; High mechanical positioning and engraving precision; |
Lifting accuracy: 0.02mm
Rotating accuracy: 0.05mm Rotating degree: 360° |
| 3-axises Back cover Laser Engraving System | Four sides and back face of phone case back cover can be automatic marked at one time;
High engraving efficiency; High mechanical positioning and engraving precision; |
Repeating accuracy: 0.02mm
Lifting accuracy: 0.02mm Clamp size: 164*80mm Rotating accuracy: 0.05mm Rotating degree: 360° |
| Sim card Laser Engraving System | Specially designed for sim card three sides automatic marking;
Suitable for materials with multiple sides; High engraving precision and efficiency; |
Repeating accuracy: 0.02mm
Lifting accuracy: 0.02mm Z-axis adjusting height: 200mm |
Laser power: 10W/30W/50W
Laser wavelength:1064nm
Q-switch frequency:20KHZ-100KHZ
Marking field: 100mm*100mm/175mm*175mm
Minimum character: 0.1mm
Marking speed : 0~7000m/s
Lifting accuracy: 0.02mm
Rotating accuracy: 0.05mm
Rotating degree: 360°
Input power : AC 220V±22V 50Hz/60Hz 10A
Power of machine : ≤500W
Machine size: 900*650*1400mm
